by LROBBINS » 01 Jan 2013, 21:31
To complicate it further, there are even more classes of electronics soldering fluxes:
traditional rosin flux
no-clean flux (a flux that can be left in place in most applications)
water-soluble flux (easier to remove if you want to remove it)
all 3 are available for lead/tin or lead-free solders
all 3 are available as paste or liquid, and at least no-clean and water-soluble are also available as "sticky" formulations that I like for doing SMD (I'm less likely to move the stuff while getting it into an oven). Some people just dissolve violinist's rosin (or even resin from pine cones) in alcohol. Haven't tried that yet.
Most people doing a lot of SMD like to use paste solder, which is finely ground solder in flux. Unfortunately, unless refrigerated it has a short shelf life, though I'm not sure that this really matters if you also use a bit of liquid flux. It's often shipped overnight on ice, which gets pretty expensive. One industrial outfit I know of uses liquid flux and powdered solder.
I've come up with my own scheme for SMD that avoids using paste solder, hot-air re-work guns, and hand soldering. I use a very fine gauge (0.4mm, 0.015") 63/37 lead-tin Kester no-clean flux solder wire. Using smooth jaw needle nose pliers, I gently flatten a strip of it so that it won't roll about. I then cut it into strips a bit longer than the entire series of the pins of an IC, or a bit longer than the length of a discrete component. (I cut enough strips for a couple day's work and store them in a clean container.) I then put a bit of no-clean tacky flux (made for lead free, but fine for lead) on all the pads on the board. I then lay the solder strips for a few components, tacky flux the component pads, and position the piece with fine forceps under a stereo microscope (a magnifying glass or very good eyes would do, I just happen to have a scope available). Once all the parts are positioned, I transfer the board to an ordinary toaster oven (the absolute cheapest that I could find at amazon.it - NOT TO BE USED FOR FOOD!).
The oven thermostat is then set at 105o C for 15 min to 1/2 hour to drive off any absorbed water, raised to 125o for another 15 minutes (even 85o use-rated components are rated at least 125o for storage). I then turn it up to ca. 200o for 5 minutes, and finally turn the oven to max and watch for when the solder starts to melt. In about 15 seconds the solder starts to flow by capillary action, wetting out the pads and disappearing from between them, and after 30 seconds I turn the oven off and leave it gently cool for a few minutes before opening the door.
With several hundred pads soldered this way so far, I've had no bridging and only one cold joint that I had to fix (probably a dirty pad on a chip). Professional equipment (paste solder, stencils, profiled ovens) would make this easier, but I don't do near enough to justify the cost of all that.
Ciao,
Lenny